ABOUT
Introduction
Simple printed heater technology uses the process of screen printing conductive or resistive paste directly onto a substrate, creating an extremely thin, lightweight, and uniform heating element. This method of manufacturing heating elements via screen printing allows for precise control of resistance values, watts density, and geometry unlike conventional wired heating technologies. Due to its flexible properties, these heaters are ideal for applications where space is limited or surface-mounted.
Tempsens manufactures printed heater designed to operate according to specific operating parameters for the industrial, medical, automotive, and aerospace sectors. They provide uniform heat distribution, quick thermal response times, and increased energy efficiency, while also allowing for the easy integration of temperature sensors and control circuits into a fully automated thermal management system.
About Printed Heater
Types of Printed Heaters
Tempsens produces two main categories of Printed Heaters:Flexible Printed Heaters are made from PET, Polyimide or Polycarbonate substrates with carbon or silver ink and either employ the use of PTC materials or fixed resistance designs.A Thick Film Heater consists of conductive, resistive and dielectric materials printed onto rigid substrates including Stainless Steel, Aluminum Nitride, and Alumina, enabling operation with a higher wattage density and faster thermal cycling.
Technical specifications of Flexible Printed Heater
| Parameter | Specification |
|---|---|
| Max Length | ~ 25 inches |
| Max Width | ~ 20 inches |
| Thickness | 0.056″ standard, other thickness available |
| Watt Density | 0.2 W/cm² |
| Wattage Tolerance | +5%, -10% |
| Maximum Temperature | Permanent temperatures of up to 90°C (max. 100°C for short periods) |
| Voltage | 10V to 240V AC or 10V to 60V DC |
| Heating Element | Silver / Carbon / PTC |
Technical specifications of Thick Film Heater
| Property | Alumina | Aluminum Nitride | Stainless Steel |
|---|---|---|---|
| Thermal Conductivity (W/m K) | 20 | 170 | 15 |
| Watt Density (w/in2) | 23 | 150 | 75 |
| Max Temperature (⁰C) | 600 | 450 | 350 |
| Coefficient Of Thermal Expansion (x 10-6/°C) | 7 | 4.6 | 12-15 |
| Voltage (V) | 240 | 240 | 240 |
Industrial Applications of Printed Heaters
- Heating surfaces and defrosting components in the aerospace industry.
- Warming medical devices and diagnostic instruments.
- Defogging automotive components such as mirror, seat and sensors.
- Thermal management for consumer electronics.
- Temperature control during food processing and packaging operations.
- Heating laboratory and analytical instruments.
- Anti-condensation systems for industrial panels and displays.
If you want to know more about printed heaters you can refer to our blog “Screen-Printed Flexible Heaters: Innovative Heating Solutions”
Why Tempsens is the Leading Manufacturer of Printed Heaters?
- More than 35 years experience in manufacturing thermal engineering solutions
- Custom substrates: PET, PI, Al2O3, stainless steel, AlN
- Mounting options: pressure sensitive & field applied adhesive
- Global manufacturing capabilities with locations in India, UAE, Indonesia, South Korea
FAQ
Frequently Asked Questions
Find answers to frequently asked questions related to Printed Heater.
Printed heater use conductive ink through a screen printing process on a substrate whereas wire wound heaters rely on resistance wire being wrapped around a core and foil heaters are manufactured with chemically etched metal sheets which require a larger profile and therefore send a great deal of waste to the landfill.
They are different technologies; flexible printed heating uses polymer materials with either silver or carbon ink and is rated for heating applications up to 90°C. Thick Film Heaters use either ceramic or metal substrates and can provide higher temperatures and watt densities.
Both printed and thick film heaters are designed for quick thermal responses, thanks to low thermal mass. A thick film heater is engineered specifically for fast heat-up and cool-down cycles in high-frequency switching applications.
